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1,300 Square Meters of Cleanroom Space at Hervanta Campus – Tampere University’s SiPFAB Semiconductor Pilot Line at the Forefront of European Chip Expertise

Published on 18.12.2025
Tampere University
Tuomas Lahtinen, SiPFABin johtaja Tampereen yliopiston Hervannan kampuksella.
Photo: Kaisa Varkila
A new high-tech cleanroom is being built at Tampere University’s Hervanta campus to develop next-generation semiconductors. The SiPFAB pilot line will offer approximately 1,300 square meters of cleanroom space, enabling the development and packaging of microelectronics and power electronics components in precisely controlled conditions.

“The design of the cleanroom is in its final stage, and construction could begin as early as spring 2026. The facility could be completed in 2027", says Tuomas Lahtinen, Head of SiPFAB pilot line.

A European Pilot Line in Tampere 

SiPFAB is part of the WBG pilot line, one of five EU-funded chip pilot lines, whose mission is to lower the threshold for companies to develop and pilot their own chip production in collaboration with the university. The project is funded through both the EU Chips Act initiative and Business Finland, with a total budget of around 40 million euros over five years. 

“Our pilot line is part of a European collaboration involving Italy, Germany, France, Austria, Poland, and Sweden. This cooperation allows us to offer companies tailored technical solutions and rapid prototyping,” Lahtinen explains. 

New Technologies and Industry Collaboration 

SiPFAB’s primary goal is to support companies, particularly in power electronics, by helping them pilot new technologies. At the launch stage, around 50 processing and characterization devices will be installed, and the unit will employ 15–20 people. 

“Integration and packaging are often overlooked in semiconductor discussions, even though almost all products using chips require them. We can tailor solutions that better serve customers’ products and end users. A faster learning cycle provides a clear competitive advantage for companies,” Lahtinen says. 

Next-generation semiconductor technology is used, for example, in electric vehicle charging and solar panels. Packaging combines memory, sensor, and telecommunication components into functional units. 

“Our goal is also to explore new approaches to packaging and to expand our expertise in power electronics. Tampere already has strong long-term expertise in materials and equipment, and now we are extending our integration and packaging capabilities,” Lahtinen adds. 

Tampere at the Forefront of European Chip Expertise 

Tampere already hosts the Finnish Semiconductor Competence Centre, and SiPFAB strengthens the city’s position as a hub for chip technology. Chips are essential in modern technology, from computers and smartphones to pacemakers. 

“Tampere alone cannot solve Europe’s chip dependency, but we are part of a strong European network developing critical expertise, boosting competitiveness, and creating new opportunities, says Petri Räsänen, Head of the “Chips from Tampere” program. 

The importance of design is highlighted by the fact that there are around 8,000 chip design professionals in the EU, of which more than 500 work in Tampere. 

“World-class chip design expertise originally grew out of Nokia’s needs. Tampere University has long contributed both to current chip technology and to educating the next generation of experts, Räsänen notes. 

Growth and New Investments 

The semiconductor industry is rapidly expanding due to AI and digitalization. Finnish companies in the sector aim to grow their annual turnover from the current 1.5 billion euros to six–seven billion euros. SiPFAB provides shared cleanroom facilities, lowering the barrier for developing new products. 

“For small companies, entering the semiconductor industry is challenging due to the need for expensive equipment and specialized manufacturing processes. The pilot line reduces this barrier and accelerates growth in Finland, particularly in Tampere, Lahtinen emphasizes. 

Tampere aims to multiply the number of chip experts in the future. The university plays a central role in both developing talent and attracting new investments. 

“Investments in semiconductors are not only multi-billion-euro projects; factory investments in the hundreds of millions of euros are also feasible in Finland. We are continuously discussing with industry to bring these to Tampere, Räsänen concludes. 


 

Open positions at SiPFAB, Tampere University

Project Manager (SiPFAB) / Projektipäällikkö (SiPFAB)
Application period ends: 2026-01-16 23:59



ChipsJU Wide Band Gap Pilot Line

Chips from Tampere

Finnish Chips Competence Centre

 

Author: Riitta Yrjönen