Research in chip and semiconductor technologies at Tampere University

FutureChips is Tampere University’s new 60-month postdoctoral-programme focusing on next-generation semiconductor technologies across four research areas: advanced materials, novel architectures, chip design and advanced packaging. The programme offers 36-month fellowships to 20 postdoctoral researchers.

The System-in-a-Package Fabrication (SiPFAB) pilot line is a new state-of-the-art research infrastructure at Tampere University, dedicated to the packaging, integration and testing of chips. SiPFAB enables the development and validation of future chip systems that are environmentally sustainable, customisable and efficiently packaged. The pilot line is specifically designed to support collaboration with industry. SiPFAB provides companies with research and development services, opportunities for pilot projects, and expert support throughout the chip integration and packaging process – from initial concept to prototype and test production. SiPFAB is part of the Wide Band Gap pilot line implemented under the Chips Joint Undertaking (Chips JU), which supports Europe’s efforts to strengthen the semiconductor and chip technology ecosystem.