Our mission is to provide internal and external facility users infrastructure access and micro- and nanofabrication services on equal basis and development of infra towards user needs while our operation is guided by Principles from academic board and general policies. Policies include:
- Policies, instruction and training material is publicly available for users (through Sharepoint)
- Users undergo safety and equipment training prior having access to infra
- Maintenance and repair of equipment is at responsibility of “equipment responsible” with help from support team
- Process development aid is available from Staff Scientist / Support team
- Chemicals are approved, indexed and their storage / disposal is carrier out by support team
- Working hours are from 7:00 to 17:00 and outside this one needs designated contact person if accessing infra
- Equipment are bookable freely with “first come, first served basis” by anyone that has right to use bookable resource
- In industrial collaboration framework we have possibility to rent equipment time or offer small services
- Industrial research projects involving infra are offered though research groups
- Infrastructure should be acknowledged in all publications using our it. TAU users should refer their publications this research environment in Tampere University Research Portal (TUNICRIS).
- Publications, presentations ect. that have been made possible by infrastructure should acknowledge infra with phrase: ”This work made use of Tampere micro- and nano fabrication facilities at Tampere university”
Pricing for equipment for external users can be found below:
| Equipment | Peak hour rate in € / h | Base rate in € / h |
| SI -cleanroom | | |
| IBS System, CEC | 150 | 56 |
| Dielectric Coater, Mattila | 57 | 21 |
| Metallization system, Mattila | 53 | 20 |
| Scriber, Dynatex | 48 | 18 |
| Dektak Profilometer | 22 | 8 |
| AFM, Veeco Dimension 3100 | 57 | 21 |
| SEM, Supra55 | - | - |
| RTA Jipelek | 21 | 8 |
| ICP1, Oxford Plasmalab 100+ (ORC) | 84 | 31 |
| ICP2, Oxford Plasmalab 100+ (Coherent) | 84 | 31 |
| RIE, Oxford Plasmalab 100+ | 76 | 28 |
| PECVD1, Oxford Plasmalab 80+ (ORC) | 50 | 18 |
| PECVD2, Oxford Plasmalab 80+ (Coherent) | 50 | 18 |
| Diener Plasmasystem | 22 | 8 |
| SSE Spin Coater | 28 | 10 |
| Suss MA6 Mask Aligner | 42 | 15 |
| EVG 620 Mask Aligner | 50 | 19 |
| Suss spin-coater | 24 | 9 |
| Suss MA6 Gen4 Pro | NA | NA |
| SK-cleanroom | | |
| Laser Tester LDC5000 | 27 | 10 |
| Laser Tester LDC | 36 | 13 |
| Burn-in Oven high power | 9 | 3 |
| Flip-chip bonder Ficontec BL2000 | 59 | 22 |
| Assembly system, Ficontec CL1500 | NA | NA |
| Shear Tester, Dage | 56 | 21 |
| Wire bonder, K&S MaximumUltra | 29 | 11 |
| Wire bonder, WestBond | 17 | 6 |
| Die-Placer West Bond | 8 | 3 |
| Resistive Evaporator | 10 | 4 |
| SL217A-characterization room | | |
| Veeco Optical Profilometer | 19 | 7 |
| Spectrofotometer | 12 | 5 |
| SK3-wafer processing laboratory | | |
| Logitech wafer thinning and polishing system and it accessories | - | 16 |
In addition, small equipment fee
| Cleanroom | Peak hour rate in € / h / equipment | Base hour rate in € / h / equipment |
| SI-cleanroom | 18 | 7 |
| SK-cleanroom | 9 | 3 |
And specific material cost associate to evaporation of gold and platinum layers: Au 41 €/100 nm and Pt 56 €/100nm
Also, the company shall pay TAU for the substrate wafers (that are provided by the university) they use in their growth processes. Specific costs for the university-provided substrate wafers are given below.
In general base rates are applied. If indicated, peak hour refers to equipment use during Monday to Friday between 7:00 and 17:00.
In case company needs training from TAU operator such training is charged 100 €/h per starting 30 min. Participation to cleanroom, laboratory and chemical safety training lectures is free assuming that such training is participated among TAU personnel.
Set of TAU SK-cleanroom garment, 25 € per set for company use.
