Our mission is to provide internal and external facility users infrastructure access and micro- and nanofabrication services on equal basis and development of infra towards user needs while our operation is guided by Principles from academic board and general policies. Policies include:
- Policies, instruction and training material is publicly available for users (through Sharepoint)
- Users undergo safety and equipment training prior having access to infra
- Maintenance and repair of equipment is at responsibility of “equipment responsible” with help from support team
- Process development aid is available from Staff Scientist / Support team
- Chemicals are approved, indexed and their storage / disposal is carrier out by support team
- Working hours are from 7:00 to 17:00 and outside this one needs designated contact person if accessing infra
- Equipment are bookable freely with “first come, first served basis” by anyone that has right to use bookable resource
- In industrial collaboration framework we have possibility to rent equipment time or offer small services
- Industrial research projects involving infra are offered though research groups
- Infrastructure should be acknowledged in all publications using our it. TAU users should refer their publications this research environment in Tampere University Research Portal (TUNICRIS).
Pricing for equipment for external users can be found below:
|
Equipment
|
Peak hour rate in € / h
|
Base rate in € / h
|
|
SI -cleanroom
|
|
IBS System, CEC
|
150
|
56
|
|
Dielectric Coater, Mattila
|
57
|
21
|
|
Metallization system, Mattila
|
53
|
20
|
|
Scriber, Dynatex
|
48
|
18
|
|
Dektak Profilometer
|
22
|
8
|
|
AFM, Veeco Dimension 3100
|
57
|
21
|
|
SEM, Supra55
|
-
|
-
|
|
RTA Jipelek
|
21
|
8
|
|
ICP1, Oxford Plasmalab 100+ (ORC)
|
84
|
31
|
|
ICP2, Oxford Plasmalab 100+ (Coherent)
|
84
|
31
|
|
RIE, Oxford Plasmalab 100+
|
76
|
28
|
|
PECVD1, Oxford Plasmalab 80+ (ORC)
|
50
|
18
|
|
PECVD2, Oxford Plasmalab 80+ (Coherent)
|
50
|
18
|
|
Diener Plasmasystem
|
22
|
8
|
|
SSE Spin Coater
|
28
|
10
|
|
Suss MA6 Mask Aligner
|
42
|
15
|
|
EVG 620 Mask Aligner
|
50
|
19
|
|
Suss spin-coater
|
24
|
9
|
|
Suss MA6 Gen4 Pro
|
NA
|
NA
|
|
SK-cleanroom
|
|
Laser Tester LDC5000
|
27
|
10
|
|
Laser Tester LDC
|
36
|
13
|
|
Burn-in Oven high power
|
9
|
3
|
|
Flip-chip bonder Ficontec BL2000
|
59
|
22
|
|
Assembly system, Ficontec CL1500
|
NA
|
NA
|
|
Shear Tester, Dage
|
56
|
21
|
|
Wire bonder, K&S MaximumUltra
|
29
|
11
|
|
Wire bonder, WestBond
|
17
|
6
|
|
Die-Placer West Bond
|
8
|
3
|
|
Resistive Evaporator
|
10
|
4
|
|
SL217A-characterization room
|
|
Veeco Optical Profilometer
|
19
|
7
|
|
Spectrofotometer
|
12
|
5
|
|
SK3-wafer processing laboratory
|
|
Logitech wafer thinning and polishing system and it accessories
|
-
|
16
|
In addition, small equipment fee
|
Cleanroom
|
Peak hour rate in € / h / equipment
|
Base hour rate in € / h / equipment
|
|
SI-cleanroom
|
18
|
7
|
|
SK-cleanroom
|
9
|
3
|
And specific material cost associate to evaporation of gold and platinum layers: Au 41 €/100 nm and Pt 56 €/100nm
Also, the company shall pay TAU for the substrate wafers (that are provided by the university) they use in their growth processes. Specific costs for the university-provided substrate wafers are given below.
In general base rates are applied. If indicated, peak hour refers to equipment use during Monday to Friday between 7:00 and 17:00.
In case company needs training from TAU operator such training is charged 100 €/h per starting 30 min. Participation to cleanroom, laboratory and chemical safety training lectures is free assuming that such training is participated among TAU personnel.
Set of TAU SK-cleanroom garment, 25 € per set for company use.
