System-in-a-Package Pilot Line SiPFAB

SiPFAB – Semiconductor Packaging and Integration Pilot Line

System-in-Package Fabrication (SiPFAB) is a new infrastructure being established at the Faculty of Information Technology and Communication Sciences (ITC) of Tampere University. Located on the Hervanta campus, SiPFAB focuses on chip packaging, integration, and testing. The pilot line provides a unique environment for combining and testing Wide Band Gap (WBG) chips and various semiconductor components as complete system solutions.

SiPFAB enables the development and experimentation of future-oriented, environmentally friendly, and customized packaged chip systems. The infrastructure supports research and pilot-scale development of emerging chip technologies that drive energy-efficient solutions for applications in industry, transportation, and energy systems.

The pilot line is strongly industry-oriented. SiPFAB offers companies research and development services, pilot opportunities, and expert support across all stages of chip integration and packaging — from concept to prototype and pre-production.

SiPFAB is part of the ChipsJU Wide Band Gap Pilot Line, which contributes to the European objective of strengthening the semiconductor technology and manufacturing ecosystem.

WBG Pilot Line infrastructures
The national nodes of the WBG Pilot line will host different cleanroom facilities enabling the transition from research to industrial-scale production in the WBG and Ultra-WBG semiconductor technologies, consolidating Europe's autonomy in the semiconductor sector.
Read more about the WBG Pilot Line