Wire bonder (TPT HB05)
Ball bonding
Wedge bonding
Stitch bonding
Flip chip bump bonding
25 µm wire (Au or Al)
Dicing saw (MTI EC400)
Used for dicing glass and silicon wafers etc.
Programmable
Saw accuracy 10 µm
Blade thickness 0.3 mm
Optical profilometer (Wyko NT1100)
High resolution 3D surface measurements from sub-nanometer roughness to millimeter-high steps.
Dicing saw (Disco DAD 3221)
Wafer dicing saw for different materials
Semiautomatic
Full automatic cutting with machine vision possible after alignment marks are teached for the device
E-beam evaporation device (System Control Technologies Orion BC-3000)
E-beam coater for metal (Al, Au, Cr, Cu, Pt, Ti, ...) thin film deposition and with the help of ion source also for nitrides (TiN etc.) and oxides.
RIE (Advanced Vacuum Vision 320 Mk II)
Reactive ion etching device with etch depth monitor.
Gasses: CF4, CHF3, SF6, Ar and O2.
Stylus profilometer (Bruker Dektak XT)
Contact profilometer with 2 µm tip radius.
Mask aligner (OAI 500)
Mask aligner for manual alignment. Hg-lamp and I-line filter.
Spin coater (Laurell WS-650Hzb-23NPPB)
For spin coating of photoresist on substrates. Chucks for 4" wafers, 49x49 mm and microscope slides as well as for smaller samples. Programmable.
Material microscope (Olympus BXM53M)
Upright microscope
Bright field, Dark field, DIC
Objectives: 2.5x, 5x, 10x, 25x, 50x and 100x
Olympus Stream software
Hot plates (several)
For lithography soft, hard and post exposure bakes.
Maskless exposure device (Heidelberg Instruments µPG501)
Projector based exposure device.
Mainly used for a glass/chromium mask fabrication. But can be used for exposing resist on wafer without physical mask. Gray scale lithography option included. Exposure wavelength 375 nm.
Resolution: 2 µm linewidth with good quality. single pixel size ~500 nm
Maximum wafer size: 5" square mask blanks
Mask aligner (SÜSS MicroTec MA6 Gen4)
LED light source, 365 nm, 405 nm, 435 nm.
Manual or automatic alignment.
Proximity, soft, hard and vacuum contact modes.
Top and bottom side alignment modes.
NIL/SMILE tools exist.
Thin film analyzer (Filmetrics F20-UVX)
Thin film thickness and other optical parameter measurements via spectral reflectance. Also transmission measurements. Wavelength range 190-1700 nm. Thickness range 1 nm - 250 µm
Microscope (Zeiss Axio Imager.A1m)
Upright microscope for bright field, dark field and DIC imaging. 2.5x, 5x, 10x, 20x, 50x and 100x objectives. Zeiss Zen software.
